Applied Embedded Electronics - Helion

ebook

Autor: Jerry Twomey
ISBN: 9781098144753
stron: 598, Format: ebook
Data wydania: 2023-11-14
Księgarnia: Helion

Cena książki: 169,15 zł (poprzednio: 196,69 zł)
Oszczędzasz: 14% (-27,54 zł)

Osoby, które kupiły tę książkę, wybierały także »

Embedded controller electronics are at the heart of virtually all modern electronic devices today with a market of more than $86 billion per year and growing. To serve the needs of designers creating products for this huge market, this practical book covers topics crucial for modern electronics design.

Author Jerry Twomey examines the methods necessary to help you create a trouble-free integrated system for your product, with an emphasis on hardware design. You'll explore topics from the perspective of real-world applications, including discussions about non-ideal components, noise, and methods for avoiding problematic scenarios.

Topics include:

Ideal versus actual connections, components, digital, signals
Architecting an embedded system
Digital interface selection by application, speed, distance
Multivoltage power supplies
High frequency power integrity
Battery and charging systems
EMI reduction and ESD protection
Driving and sensing peripherals
Digital feedback control
Optimization of power consumption and cost
Specialty systems: medical, industrial, aerospace
PCB design including manufacturability, yield, and low noise

This book guides you through all of the techniques listed, which are required for a reliable integrated system. Through extensive illustrations and minimal equations, anyone with an interest in electronics will quickly grasp the ideas discussed.

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Spis treści

Applied Embedded Electronics eBook -- spis treści

Preface
- Why I Wrote This Book
- Who This Book Is For
- Evolving Design Methods: A Different Approach
- How This Book Is Organized
- Conventions Used in This Book
- OReilly Online Learning
- How to Contact Us
- Acknowledgments
1. Essential Concepts
- Basic Electronics
- Ideal Simplifications of Academia
- Interconnections
- Basic Components
  - Capacitors
  - Resistors
  - Inductors
  - Voltage Sources and Batteries
  - Current Sources
  - Switches and Relays
  - Operational Amplifiers
  - Voltage Comparators
- Nonideal Digital Devices
- Signal Integrity
- Summary and Conclusions
- Further Reading
2. Architecting the System
- Preliminary Ideas
  - Simulate or Build
  - Through-Hole/Leaded Components (Obsolete)
  - Discrete Gate Logic (Obsolete)
- Modern Design Strategies
  - Mostly Digital Design
  - DSP Methods: Versatility and Limits
  - Digital Control Methods: DCU, MCU, MPU, FPGA, CPLD, and ASIC
- Terminology in MCU and MPU Specifications
- Hardware Controllers
- Software Controllers
- Computers Versus Controllers
  - Raspberry Pi (MPU) Versus Arduino (MCU)
  - Multipurpose and Specialty MCUs
- Chip Set Methods
- System Architecture Options
  - Determine Peripherals and Interconnects
    - Human inputs
    - Switch inputs
    - Sensor inputs
    - On-board data communication
    - Off-board data communication
    - Indicators
    - Electromechanical controls
    - System support
    - Data streams
  - Avoid Serial Communication Bottlenecks
  - Use Direct Memory Access for Data Transfer
  - Determine DSP Methods
  - Check for DSP Bottlenecks
  - Improve DSP Speed
  - Determine DCU Internal Features
    - General-purpose input/output (GPIO) ports
    - Serial data communication
    - Internal ADC capability
    - Internal DAC capability
    - Comparators
    - Real-time clock
    - Clock generation system
    - Power consumption
    - Power supply voltage
    - Programmable memory
    - RAM size
    - Interrupt handling capability
    - Floating-point math capability
    - Operating temperature
    - Power on reset and brownout detection reset
    - Radiation hardened designs
    - Direct memory access capability
    - Watchdog timer
    - Timer counter circuits
    - Sleep and low-power modes
- Physical Package Considerations
- Off-Chip Features and Support
- Pulling It All Together
- Picking a DCU Configuration and Your MCU/MPU
  - Specialized Niche Function or Feature
  - Multi-MCU Systems
  - General-Use MCU Systems
  - Picking a Specific MCU
- Summary and Conclusions
- Further Reading
3. Robust Digital Communication
- Digital Signals, Physical Considerations, and Connections
  - Limitations of Ground-Referenced Digital Signals
  - Low-Voltage Differential Signaling
  - Organizing Interconnects for Speed and Signal Integrity
  - Lumped Versus Distributed Networks
  - Clock Distribution
- Digital Communication: Parallel Versus Serial Ports
- Clocking Methods for Serial Ports
  - Starting Edge Synchronization
  - Parallel Clock
  - Manchester Code Self-Clocking
  - Embedded Clock and Run Length Limited Codes
- Digital Communication: Features and Definitions
- Serial Data: Shared Ground, Low Speed
  - Universal Asynchronous Receiver Transmitter
  - Inter-Integrated Circuit and System Management Bus
  - Serial Peripheral Interface
  - Single-Wire Interfaces
- Serial Data: Shared Ground, High Speed
- Data Between Boards or Between Systems: Wired Methods
  - RS-232: Serial Data over Cable
  - RS-485: Differential Serial Data over Cable
  - Controller Area Network
- Serial Data for Computer Systems
  - Universal Serial Bus
  - Serial Advanced Technology Attachment
  - Peripheral Component Interconnect Express
  - Ethernet
- Wireless Serial Interfaces
  - WiFi
  - Bluetooth
  - Bluetooth Low Energy
  - ZigBee
  - Z-Wave
  - Adaptive Network Topology
- Other Data Communication Methods
  - Infrared
  - Fiber-Optic Data: Go Fast, Go Far
  - JTAG: PCB Access for Test and Configuration
- Summary and Conclusions
- Further Reading
4. Power Systems
- Split Phase AC Mains Power
- AC Power Safety: Defining the Problem
  - High-Voltage and Low-Voltage Partitioning
  - Safe Failure Methods and Single Fault Safe Scenarios
  - Overcurrent Protection Methods and the Weakest Link
- AC/DC Conversion
  - The Classic Approach: 60 Hz Transformers
  - Off-line Switchers
- Multi-PCB Systems: The Need for Local Power Regulation
- DC/DC Conversion: Linear Versus Switching
  - Linear Regulators: Conceptual
  - Emitter Follower Regulators Versus LDO
  - Switching Step-Down (Buck) Converter
  - Switching Step-Up (Boost) Converter
  - Switching Buck-Boost Converter
- Picking Regulators and Configuring a Power System
  - Including Power Supply Monitors
  - Power Bypass, Decoupling, and Filtering
  - Radiated Noise Reduction: RC Snubbers, Ferrites, and Filters
  - Power Output Noise Reduction: Damped LPF Networks and Cascaded Regulators
- Power Grid Current Surges Due to Digital Logic
  - Low-Impedance Power and Ground Planes
  - Power Supply Bypass Filtering: Distributed Stabilization
  - Bypass Capacitors at High Frequencies
  - Power Bypass Capacitor Value and Distribution
- Summary and Conclusions
- Further Reading
5. Battery Power
- Battery Basics: Definitions
  - Decision Guidelines for Rechargeable or Single-Use Batteries
  - Defining Power Requirements
  - Battery Discharge Versus Functional Voltage Range
  - Battery Types by Chemistry
  - Discharging Behavior of Batteries
- Designing a Battery Set: Single Use and Multiple Cells
- Designing a Rechargeable Custom Battery Pack
- Charging Batteries
- Smart Batteries
- Regulations and Safety for Batteries
- Other Energy Storage and Access Methods
  - Supercapacitors
  - Hydrogen Fuel Cells
  - Flow Batteries
  - Wireless Power
  - Solid State Batteries
- Summary and Conclusions
- Further Reading
6. Electromagnetic Interference and Electrostatic Discharge
- Preliminary Ideas
  - Intrinsic Noise
  - General Strategy Dealing with EMI
  - Regulations and Requirements
  - Visualizations of Noise Coupling
  - Frequency Domain Analysis of EMI
- Grounding
- Reducing Conducted Emissions to AC Power Mains
- Cable Interconnect Strategies
- Reducing Noise Generation at the Source
  - Slower Clocks and Softer Transitions
  - LVDS for Digital Data to Reduce EMI
  - Spread Spectrum Clocks to Reduce EMI
  - EMI Reduction for Switched-Mode Power Supplies
  - Unintentional EMI Antennas
  - EMI Suppression on Motors
- Reducing Noise Coupling Between On-Board Devices
  - Identifying the Big Talkers and Sensitive Listeners
  - Floor-Planning the PCB for Noise
  - Faraday Cage Methods to Contain or Protect from EMI
- Making Circuits Less Noise Sensitive
  - Noise-Sensitive High-Impedance Nodes
  - Noise Immunity of Differential Signals
  - Noise Immunity Through Bandwidth Limiting
- Suppressing Noise into and Out of the System: Faraday Cage Techniques
- Electrostatic Discharge Protection
- Summary and Conclusions
- Further Reading
7. Data Converters: ADCs and DACs
- DAC Performance Basics
- ADC Performance Basics
- Antialiasing Filters for ADC Inputs
- Pulse Width Modulation DACs
- Arbitrary Waveform Generation by Direct Digital Synthesis
- Summary and Conclusions
- Further Reading
8. Driving Peripheral Devices
- Switched Driver Circuits
  - High- and Low-Side Switching
  - High-Power Load Isolation
  - Drive Signal Strategies
  - Power Transistor Selection
  - Power Transistor Thermal Performance
  - Driving LEDs and Buzzers
- Selection of Static Displays
- Streaming Video Output
- Driving Inductive Loads
  - Transient Current in a Switched Inductor
  - Driving Solenoids and Relays
- H-Bridge Drive Circuits
- Driving DC Motors
  - Motor Selection
  - Brushed DC Motor Driver Circuit
  - Brushless DC Motors: Single and Three Phase
  - Motors with Integrated Control Electronics
  - Stepper Motors
  - Voice Coil Motors
  - Stall Currents and Protecting from Self-Destruction
- Audio Outputs
- Summary and Conclusions
- Further Reading
9. Sensing Peripheral Devices
- Sensors for Everything
- Sensor Output Types
- Sensor Data Capture and Calibration
  - Data Capture Method
  - Sensor Calibration
  - Sensor Response Time
- Two-State Devices: Switches, Optical Interrupters, and Hall Sensors
- Position and Rotation Encoders
- Analog-Linear Sensors: A Closer Look
  - Characteristics of Analog Sensors
  - Signal Processing for Analog Sensors
  - Sensor Calibration
  - Current Sensing Methods
  - Voltage Sensing
- Specific Sensor Applications
  - Pressure Sensors
  - Temperature Sensors
  - Strain Gauges
  - Sound and Microphones
  - Image Sensors and Video Cameras
  - Touch Panels
- Summary and Conclusions
- Further Reading
10. Digital Feedback Control
- Overview of Sequence and Feedback Control
- Digital Versus Analog Circuit Methods
- Preliminary Definitions and Concepts
  - Transfer Functions, Block Diagrams, and Basic Feedback
  - Transient Response Terminology
- DUC Performance Selection
- Sequence Control
- Select Topics in Analog Control Systems
  - Linear Systems and Approximations
  - Bode Plots for Stable Control Loops
  - Bode Plots for Gain and Phase Response
  - Bode Plots for Gain and Phase of a Control Loop
  - Bode Plots for Integral and Derivative Response
  - Bode Plots of Fixed Time Delays
- Transition to Digital Control
  - Determine DUC Stability
  - DAC Performance Requirements
  - Accuracy of Control Math
  - ADC Performance Requirements
  - ADC Sampling Rate Determination
  - Final Selection of ADC and DAC
  - Dual-Clock Strategy for Improved Phase Margin
  - Digital Trapezoid Integration
  - Digital Integration: Limit Windup and Avoid Saturation
  - Digital Derivative by Adjacent Samples
  - Additive Time Delays in the DSP
- PID Control Implementation
  - Response Variants: P, I, PI, and PID
  - Typical Effects of Gain Adjustments
  - Ziegler Nichols Tuning
  - ChienHronesReswick Tuning
- Component Variance and Control Tuning
- Adaptive Control Methods
- Trajectory Control Methods
- Summary and Conclusions
- Further Reading
11. Schematic to PCB
- PCB Terminology
- PCB Design (EDA) Tools
- Getting Started
- Component Selection
  - Selecting RLC Components
  - Picking Connectors for Off-Board Wires
  - Selecting IC Packages
  - Checking Component End of Life and High-Quantity Availability
- Including Test Access and Interface Ports
- Schematics
  - Schematic Sheets and General Organization
  - Symbol Organization for Integrated Circuits
  - Placeholders and Do Not Populate Components
  - Provide Generous Commentary
  - Avoid Ambiguity
  - Call Out Items Requiring Special Attention
- Bill of Materials
- Defining Physical, Control, and Data Layers
- Defining a Component Footprint
- Mechanical Definition of a PCB
  - Metric Versus Imperial Measurements
  - PCB Mounting
  - Electrical Grounding Through Mechanical Mounts
  - Drilled Hole Spacing and Keep-Outs
  - Cables to the PCB
  - PCB Alignment References
  - Conformal Coating
  - Test Fixture Using Bed of Nails
- Defining the PCB Layer Stack-Up
- Interplane Capacitance
- Physical Design Rules
  - High-Voltage Spacing Rules
- Component Placement Strategy
- General Interconnection Methods
  - Easy Estimations of RLC Parasitics
  - Maximum Trace Currents
  - Determine Minimum Geometry Trace Requirements
- Vias and Micro-Vias
- Vias for Thermal Conduction
- Specialized Interconnection Methods
  - Differential Signal Routing
  - Microstrip Transmission Lines
  - Stripline Transmission Lines
  - Differential Microstrips and Striplines
  - Kelvin Connections
- EMI and ESD Strategies
  - Solid Ground Plane for Less EMI
  - Flooded Signal Layer Grounds for Less EMI
  - ESD Interconnect
  - High-Frequency Power Bypass Methods
- Features for Manufacture and Assembly
  - Consistent Copper Coverage
  - Panelization and Break-Apart Methods
  - Fabrication Notes
  - Manufacturing (Gerber) Files
- Summary and Conclusions
- Further Reading
12. Software and Coding
- Coding Languages
- Operating Systems
  - Picking an RTOS
    - Embedded Linux
    - Embedded Android
    - FreeRTOS
    - QNX
    - VxWorks
    - INTEGRITY
    - ARM Mbed OS
    - Zephyr Project
    - TI-RTOS
    - Nucleus RTOS
    - Windows 10 IoT
    - Additional offerings
  - Additional RTOS Considerations
- Configuring Ports and Processors
- Device Drivers
  - Problematic Portability
  - Peripheral Communication
  - Initiating Peripheral Communication
  - Device Driver Features
  - Modularity/Hierarchy for DD Code
  - Testing the DD
- Defensive Coding Methods
  - Preprocess Data Inputs (Invalid Data)
  - Preprocess Data Inputs (Bandwidth Restrictions)
  - Preprocess Data (Human Input)
  - Background Reinitialization
  - Watchdog Timers
  - Multicontroller Coding
- Suggestions for Well-Organized Code
- Summary and Conclusions
- Further Reading
13. Special Systems and Applications
- Different Electronics for Different Priorities
- Design Priorities
  - Product Cost
  - Quality and Reliability
  - Power Consumption
  - Safety
  - Backward Compatibility
  - Ruggedness and User Abuse
  - Capability for Repair
- Navigating the Regulatory Maze
- Risk Analysis
- Aviation Electronics (Avionics)
  - Design Priorities
  - Special Needs
  - Regulations, Certifications, and Approvals
- Satellites and Spacecraft (Astrionics)
  - Radiation
  - Thermal Extremes
  - Vibration, Shock, and Acceleration
  - Vacuum Environments
  - Component Selection and NASA-Approved Parts
  - PCB Materials and Layout
  - Limited Life of Spacecraft
    - Disposable satellites
    - Mass-produced satellites
  - Regulations, Certifications, and Approvals
- Military Electronics
  - Design Priorities and Unique Requirements
  - Regulations, Certifications, and Approvals
- Medical Devices
  - Regulations, Certifications, and Approvals
  - Clean Functionality Throughout EMC Tests
  - Special Needs
    - ESD functionality
    - Power dips
    - Patient isolation safety
  - Regulatory Requirements for Software and Firmware
- Automotive
  - Typical Electronic Control Units
  - Design Priorities and Special Needs
  - Regulations, Certifications, and Approvals
    - Vehicular safety and performance
    - Electronic components internal to ECUs
    - Coalition for a software-defined ECU platform
    - Society of Automotive Engineers
    - Testing and regulatory requirements for ECU modules
    - Automotive ECU consolidated test list
- Consumer Electronics
  - Design Priorities
    - Cost
    - Volume manufacturing
    - Visual appeal
    - Ease of use
    - Repair capability
    - Reliability
    - Backward compatibility
  - Special Interest Groups, Technology Coalitions, and Technical Standards
  - Regulations, Certifications, and Approvals
    - FCC EMI certification
    - Underwriters Laboratories safety certification
    - CE mark
  - Restriction of Hazardous Substances
  - Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH)
- Industrial Automation
- Summary and Conclusions
- Further Reading
14. Creating Great Products
- Create Products That Solve Problems or Fulfill a Need
- Identify the Target Market
- Identify What the Customer Wants
- Examine Competing Products
- Define the Value Proposition
- Determine Viable Pricing
- Determine a Properly Timed Market Window
- Establish Coalitions and Strategic Partners
- Focus on Ease of Use
- Determine the Needed Resources
- Get Design Specification Consensus
- Minimal Design and Feature Creep
- Identify Obstacles Early
- Get User Feedback on Prototype Builds
- Make It Easy to Manufacture
- Summary and Conclusions
- Further Reading
Glossary of Acronyms
Index